Scanning Acoustic Microscopy (SAM) is a powerful non-destructive testing technology that uses high-frequency ultrasound to detect internal structural features of materials without damaging samples. It has been widely adopted in both academic research and industrial manufacturing.

In universities and research institutions, SAM plays a vital role in the research and development of chips and integrated circuits. It is commonly used for laboratory inspection of chip samples, accurately identifying hidden internal defects such as delamination, voids, microcracks and interface debonding. Researchers rely on SAM to analyze structural reliability, verify packaging processes, and support innovative development of advanced semiconductor chips and integrated circuits.

In industrial scenarios, scanning acoustic microscopy is also applied to mass production lines of factories. It enables rapid, efficient and consistent batch inspection of finished semiconductor products. It helps manufacturers screen defective items in time, control production quality, reduce failure rates, and ensure the stability and reliability of large-scale chip production.

Overall, SAM serves as an essential testing tool that connects academic laboratory research and industrial mass production, providing reliable non-destructive detection solutions for the entire semiconductor industry chain.

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Application Scope of Scanning Acoustic Microscopy

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