Applications

Scanning Acoustic Microscopy (SAM) has become an indispensable non-destructive testing technique in semiconductor laboratories. It is widely applied for internal defect detection and quality evaluation of chip samples.

Utilizing high-frequency ultrasonic waves, SAM penetrates the chip packaging and layered internal structures without causing any damage to the specimens. It effectively identifies typical hidden defects such as delamination, voids, cracks, debonding and interface separation inside semiconductor chips. Compared with traditional detection methods, it features high resolution, full non-destruction and intuitive imaging capability.

In routine laboratory research and mass sample screening, SAM enables researchers and engineers to visualize internal structural anomalies of chips, analyze defect distribution and root causes, verify packaging reliability, and screen unqualified products at an early stage. It provides critical technical support for chip process optimization, failure analysis and batch quality control in semiconductor R&D and production laboratories.